manufacturing
165℃/3H
110℃/1H+150℃/3H
70℃/2H
manufacturing
Plasma affects the material’s surface to cause physical and chemical reactions. Active particles and high-energy rays are used to react with the surface’s organic pollutant molecules. They collide and form small molecule volatile matters which then detach from and clean the surface.
Different from traditional detachment operations, the connected wire bond machine with fully autonomous conveyance feeding does not require manual transferring, thus safeguarding stable operations of the processes.
Improve the adhesive force between the wire bond tail and lead frame functional area.
Lower the wire bond breakdown rate and improve the wire bond efficiency.
A high level of cleanness in the lead frame bowl, with an improved binding force between the packaging gel and the bowl.
AOI is the international latest-model testing technique. During the automatic inspection, the machine will utilize its camera to scan the sample, collect images, and then compare them with qualified parameters in the database. Images processed in this way will reveal the faults. Displays or autonomous marks reveal the faults and their reasons promptly, thus greatly improving production efficiency.