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manufacturing

Three-inspection for key processes

first inspection>>> self-inspection>>>tour inspection

  • Self-inspection in the operator process-Die Bond
  • Self-inspection in the operator process-Wire Bond
  • Self-inspection in the operator process-Coating
  • Self-inspection in the operator process-inspection
  • Self-inspection in the operator process -AOI inspection
  • Self-inspection in the operator process-Sorting
  • Self-inspection in the operator process-Visual inspection
Reliable labs

Matching equipment-based testing and reliable equipment for quality control from bringing in materia

  • Bracket toughness tester
  • Peeling force tester
  • Electroplating coating tester
  • Autonomous push/pull tester
  • Thermal shock tester
  • Everfine HAAS3000 precision quick spectrum scanner
  • Everfine HAAS2000 precision spectral testing machine
  • LED automatic temperature control testing system
  • Room temperature system&LED high-temperature system
  • LED constant temperature and humidity testing machine
  • High-grade metallographic microscope
  • SEM desktop scanning electron microscope
  • Eight-warm-area reflow soldering machine
  • X-Ray

Independent labs for analyzing failed products and testing the reliability of mass-production products

In R&D for actual production, life tests should be done for LED lamps’ reliability to utilize quality feedback to improve reliability and ensure quality.

Product Development Experiment Project

Classification Experiment conditions Sample quantity Judgment standards
Thermal shock test （-40℃±5℃?125±5℃）
Time: 30min/cycle, 500 cycles 		2000 Failure rate≤0
High-temperature high-humidity aging Temperature (Ta):85℃±5℃，Humidity(RH):85%
168H/500H/1000H 		22 Light decay rate≤10%，
Single-lamp light decay rate ≤15%, x/y hue drift <0.01
ORT 150℃/1H->Temperature(Ta):85℃±5℃，
Humidity(RH):85%/8H+reflow soldering of three times（MAX260℃/10S)->
Thermal shock test 100cycle (Regular) 		2000 Failure rate≤0
Cold and heat ratio test 25℃±5℃?85±5℃?105±5℃
Luminous flux differences of test materials 		10 High/low luminous flux differences
Average value≥85%
High-temperature aging 85℃±5℃（PPA）/ 105℃±5℃（PCT）
168H/500H/1000H chip rated current 		22 Light decay rate≤5%，Hue drift <0.01
Gas tightness Reflow soldering（260℃/10s）Industrial ethanol 1:1 red ink，
Boiling for 2H/Heating table temperature set at 150℃, observed every one hour 		10 PPA/PCT copper lead frame with no leakage for 2H
Vulcanization 105℃±5℃/2H,materials placed at the contain top, tested every 1H. 10 Average value decay rate≤10%，Single-lamp maximum ≤15%
Normal-temperature aging Temperature(Ta):25℃±5℃ 168H/500H /1000H 22 Hue drift＜0.01，
Light decay 500 average value decay rate ≤2% (1000H average value decay rate≤5%）
Single-lamp should be ≤8%, negative light decay allowable
Impulse experiment One second per time (0.5S respectively to on and off)/
The electrical current should be the maximum value in chip design，Aging168/500H 		22 Light decay rate≤5%，Hue drift <0.01
MST Temperature(Ta):105℃±5℃168H，1.5 times the rated current 10 Voltage excursion ≤±5％
ORT processes for shipping spot-check

Before shipping, a spot-check is done for rigorous reliability testing to ensure delivering quality products to customers

Spot-check different product work orders for reliability tes
High-temperature and high-humidity(85 ℃ 85%/8Hrs)
Three times of reflow soldering（MAX260℃/10s)
Thermal shock test 100 cycle
(-40 ℃/15min-125 ℃/15min)
High-temperature aging(105 ℃/168Hrs)
Judgment standards：
Shipping without any abnormalities such
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